High Speed Serial Communications

High-speed digital standards are quickly evolving to support the performance demands of our data driven world. Next generation serial standards and data communication requirements are bringing new test challenges, pushing the limits of today’s compliance and debug tools. From design and simulation, analysis, debug, and compliance testing, Tektronix provides advanced, automated measurement solutions to optimize performance, speed up validation cycles and accelerate time-to-market.

Library

Title
PCI Express® Transmitter PLL Testing — A Comparison of Methods

Overview of significant methods for performing PLL Testing

Probing Tips for High Performance Design and Measurement

Learn how to identify common signal integrity problems experienced in high speed and mobile designs, modeling techniques used to study and de-embed the effects of probing, probing considerations for low power circuits and much more in this detailed application note for high performance designs.

High Speed Interface Standards

This e-Guide will help you learn more about design challenges for testing PCIe 4.0, SAS, SuperSpeed USB, and DDR4 standards. Within the pages of the eGuide you will also get quick access to technical resources that will help you understand design challenges and pick the right solution for your test needs.

Remote Head Acquisition Improves High Speed Serial Measurement

Learn how to maximize the margin in your signal integrity measurements.

Fast+ Efficient Solutions for DVI Conformance Measurement Challenges

Tektronix provides all the DVI measurement solutions you need, ranging from high-bandwidth digital phosphor oscilloscopes (DPO) to probes to application-specific software. Tektronix has solved tough measurement problems like jitter and eye diagram tests to assemble a DVI solution that automates and simplifies your work.

Characterizing an SFP+ Transceiver at the 16G Fibre Channel Rate

Measurements needed to test an SFP+ transceiver to the 16G Fibre Channel standard.

The USB 3.1 Receiver application's Margin Test feature gives engineers…

3:34

Tektronix supports many applications where AWGs are heavily used with plug-ins…

26:01

This video focuses on the Link Training Status State Machine UI feature of the…

4:35

Tackle today's high-speed serial signals and tomorrow's too with the scalable…

2:04

This short video shows how to debug a compliance measurement that has failed by…

4:35

The NEW P7700 Series TriMode Probe provides the highest probe fidelity available…

0:54

This video details the the BERTScope's Error Location Analysis tool that provides…

11:11

This webinar provides insight into the future of mobile device design and test,…

54:10

This video highlights some of the newest features and capabilities of the USB 3.1…

5:25

Watch this video to get an overview of the new Link Training Tool, which forms…

1:31
Title
Demystify MIPI D-PHY and C-PHY Transmitter and Receiver Physical Layer Test

During this webinar, you'll gain an understanding of MIPI test challenges for both MIPI high-speed physical layers and useful tips and technical insights into characterizing and validating design compliance.

How to Address Your Toughest Serial Bus Design Challenges with EDA and Measurement Correlation

This Tektronix webinar will teach engineers how to use modeling tools to correlate simulations with high-speed physical layer measurements on Serial Bus Standards using the DPO/MSO70000 Series Oscilloscopes.

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