Live Chat with Tek representatives. Available 9:00 AM - 5:00 PM CET.
Offering short signal paths, controlled line impedance, and a solution for integrated circuits (ICs) with high-interconnect density, ball grid array (BGA) packages provide a means of reducing component size while supporting high-density interconnect requirements.
Utilizing circuit simulation, electromagnetic simulators and other advanced design tools, Tektronix Component Solutions provides custom BGA assembly and development services. Our advanced BGA assembly services include the option of cavity-down, dam-and-fill and glob encapsulation solutions, to meet your specific application requirements.
High Performance BGA Development
Through our turnkey IC package design, assembly and test services, Tektronix Component Solutions delivers advanced BGA packages for use in high performance and high reliability applications. Our turnkey services help ensure that devices are designed for manufacturability and testability, assembled efficiently and fully tested to ensure reliability. In addition to custom BGA assembly and development, Tektronix Component Solutions also offers 15 and 32+ GHz flip chip ball grid array (FCBGA) IC package platforms. These package platforms are an ideal fit for customers requiring broadband, high-pin count ASIC packaging solutions.
15 & 32 GHz FCBGA Platforms:
- Available in either organic (PTFE) or ceramic (LTCC) substrate technology options
- Flip chip interconnect for high pin count ASICs (>150 pins) with bump pitch <200 µm
- Up to 15 GHz bandwidth (RL ≤ -15 dB, IL ≥ -2 dB) or up to 32 GHz bandwidth (RL ≤ - 10 dB, IL ≥ -2 dB)
- Moisture sensitivity level 4
Flip Chip Ball Grid Array Process Capabilities:
Tektronix Component Solutions can assemble FCBGA devices within the boundries of the following process capabilities:
BGA Ball Chemistry
63SnPb or SAC305
BGA Ball Diameter
18 / 24 / 30
BGA Pitch (min)
1 / 1.27
BGA Pad Definition
Substrate Pad Diameter
0.8 x Solder Ball Diameter
0.7 x Solder Ball Diameter
27 x 27
40 x 40
Number of C4 I/Os (max)
Die Size (max)
Underfill Keepout Around Die (min)